Tag Archives: Solution for 3G Smartphones
Industry`s first HSPA+ solution offering true 21Mbps downlink performance based on a leading-edge 40nm baseband processor
Neubiberg, Germany and Barcelona, Spain – Feb. 14, 2011 – Intel Mobile Communications, a leading vendor of advanced mobile semiconductors solutions for handheld devices, today announced shipment of its XMM™ 6260 platform to key customers. Optimized for smart phone architectures coupled with an application processor or as a standalone solution for PC modems and data cards, the advanced HSPA+ platform is based on the X-GOLD™ 626 baseband processor and the SMARTi™ UE2 RF transceiver. Combined with the 3GPP Release 7 protocol stack, the XMM 6260 platform comprises a fully integrated HSPA+ system solution supporting HSPA category 14 (21Mbps) in the downlink and category 7 (11.5Mbps) in the uplink.